The new Molex HSAutoLink G Connector System provides multi-gig Ethernet connections of up to 25Gbps in a compact, USCAR-compatible interface, making it ideally suited to address escalating bandwidth demands driven by Advanced Driver-Assistance Systems (ADAS), radar, LiDAR, zonal architecture, immersive displays and central compute modules.
"As the automotive industry transitions to Software-Defined Vehicles (SDVs), automakers must overcome major performance bottlenecks while ensuring the highest levels of reliable connectivity," said Min Kong, regional general manager, Connected Mobility Systems (CMS), Molex. "The HSAutoLink family has been a trusted backbone for vehicle architectures for nearly two decades. Building on that legacy, the new HSAutoLink G system gives OEMs a field-proven upgrade path, improving supply chain flexibility and resiliency for faster time to market."
Design Flexibility and Rugged Reliability
Engineered to fit within existing USCAR Ethernet interfaces, the Molex HSAutoLink G Connector System enables flexible, future-proof product designs that reduce space and weight in compact modules while streamlining system integration and upgrades. Advanced Electromagnetic Interference (EMI) shielding and controlled differential impedance preserve signal integrity for high-speed communications in dense environments, helping prevent signal failures, validation delays and costly design changes.
In addition, this latest offering in the Molex HSAutoLink family features an anti-stubbing design that protects the contacts during the mating process, reducing the risk of mis-mating. In keeping with this focus on rigorous automotive validation, Molex also has added multiple, uniform ground-contact points to enhance EMI suppression for heightened performance reliability.
Increased Supply Chain Optionality
The new Molex HSAutoLink G family, including terminals, connectors, Printed Circuit Board (PCB) headers and cables, provides automotive OEMs and tier-one suppliers with true sourcing optionality through full adherence to industry-standard USCAR footprints. This standardized compatibility is backed by Molex's global manufacturing footprint and robust engineering support, reinforced by extensive, real-world simulations and reliability tests to optimize performance under the harshest conditions.
Advancing Innovation
Molex delivers highly qualified alternate connector sources, which are critical for fast-moving, high-volume markets in China, and gaining traction across other global sectors where the shift to 25G automotive Ethernet is gaining momentum. The growing uptick underscores Molex's broader commitment to simplifying complex vehicle electronic architectures, pairing high-speed automotive communication protocol solutions, like HSAutoLink G and Molex HFM, with advanced innovations, such as the Molex MX-DaSH Connector System, to seamlessly integrate power, signal, and ultra-high-speed data transfer within a unified, space-saving architecture.
About Molex
Molex is a global electronics leader committed to making the world a better, more-connected place. With a presence in more than 40 countries, Molex enables transformative technology innovation in the consumer device, aerospace and defense, data center, cloud, telecommunications, transportation, industrial automation and healthcare industries. Through trusted customer and industry relationships, unrivaled engineering expertise, and product quality and reliability, Molex realizes the infinite potential of Creating Connections for Life.
For more information, please visit www.molex.com.
